Overview
ABSTRACT
Production of integrated circuits requires a large number of manufacturing steps at nanometric scale. Processes are not perfect so the test at the end of manufacturing aims at detecting all potential defects, before distribution to customers. This article presents the basic concepts, the methods and tools used to discriminate circuits with and without defects. It describes the types of tests, the models associated to physical defects and test vector generation techniques. The problems due to continuous transistor size reduction are also mentioned and their impact on the production quality are underlined.
Read this article from a comprehensive knowledge base, updated and supplemented with articles reviewed by scientific committees.
Read the articleAUTHORS
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Mounir BENABDENBI: Senior lecturer at Grenoble Polytechnic Institute (Grenoble INP) - Computer and Microelectronics Techniques for Integrated Systems Architecture Laboratory (TIMA), - Grenoble, France
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Régis LEVEUGLE: Professor at Grenoble Polytechnic Institute (Grenoble INP) - Computer and Microelectronics Techniques for Integrated Systems Architecture Laboratory (TIMA), - Grenoble, France
INTRODUCTION
IC testing is not a new field, but one that is constantly evolving. In the early days of IC production, the design engineer and the test engineer were generally well separated. The former would decide which elements were to be implemented in the circuit, and how these elements were to be drawn on the physical substrate; the latter would decide how to effectively determine, at the end of production, whether the circuit was free from manufacturing defects and could be delivered to the customer. The former had to guarantee design-error-free functionality; the latter had to ensure detection of any physical defects. With the rapid growth in circuit complexity, this clear separation of responsibilities became obsolete. The move towards VLSI (Very Large Scale Integration) meant that it was impossible to test the circuit effectively in production if the test had not been planned for during the design phase; the quality and cost of the test became directly linked to the design choices made and the information provided by the designer in preparation for the test.
The preparation of test vectors is now the responsibility of the designer. This article is essentially devoted to this aspect, which includes the need to choose physical defect models according to technologies. These vectors are then translated into programs for the test equipment (ATE: Automatic Test Equipment) used on production lines.
The notion of Design for Testability (DFT) has also emerged (§ 3)
The aim of this article is to provide an overview of the most important concepts in the field, without claiming to be exhaustive. The information provided in the bibliography will enable you to delve deeper into the points you need to know in a given context. In particular, as this article has been written from the designer's point of view, aspects relating to the implementation of testing in the production phase are barely touched upon. ETA features are only mentioned where they have a direct impact on the designer's work. Furthermore, this article focuses on the testing of digital circuits, and the case of non-CMOS (Complementary Metal Oxide Semiconductor) circuits is only partially...
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KEYWORDS
reliability | defect | test | fault
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Testing digital integrated circuits
Bibliography
Paragraphs 1 to 4
Conferences
Many journals, symposia and conferences in the field of circuit design have sessions devoted to testing and may be of interest to supplement the information given in this article.
International test conference (ITC) (United States)
VLSI test symposium (VTS) (United States)
European test symposium (ETS) (Europe)
Design automation...
Standards and norms
IEEE 1149 standard, also known as the Boundary Scan standard, for testing board-based systems, https://standards.ieee.org/
ISO 26262 standard for vehicle functional safety,
RTCA DO 254 standard for functional safety in aeronautics,
Directory
Foundries: integrated circuit manufacturers (non-exhaustive list)
TSMC
Samsung Electronics
Global Foundries
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