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7. Glossary
ball :
Bille.
bump:
Bosses that allow contact to be made with a ball.
bonding :
Gluing.
chip :
Chip.
copper pillar :
Copper interconnection often topped with fusible material for brazing.
dicing :
Sawing, chip cutting.
Embedded :
Embedded, buried.
Packaging:
Encapsulation.
flip chip :
Flip chip.
FR4 :
Material used to manufacture CIs.
I/O :...
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Glossary
Table of acronyms
Bibliography
Publications and reviews
IEEE Transactions on Components, Packaging and Manufacturing Technology, https://www.cpmt.org
Chip Scale Review – Haley Publishing – https://www.chipscalereview.com
Électronique Mag – Tracks and tablets – Éditions Alain...
Events
ECTC (Electronic Components and Technology Conference) organized by IEEE CPMT – http://www.ectc.net
IMAPS International Symposium on Microlectronics http://www.imaps.org
Standards
IPC: Association Connecting Electronics Industries http://www.ipc.org/
JEDEC (Joint Electron Device Engineering Council) – http://www.jedec.org
Directory
International networks – Organizations – Federations – Associations (non-exhaustive list)
ITRS – International Technology Roadmap for Semiconductors – http://www.itrs.net/home.html
iNEMI – International Electronics Manufacturing Initiative – http://www.inemi.org
...Semiconductor market trends
Little by little, the conventional type of individually packaged chips is evolving towards more compact solutions, improving performance and enabling greater functionality. Table 1 shows the expected evolution of package type between 2011 and 2018...
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