Article | REF: E3401 V1

Packaging and interconnection processes for electronics components

Author: Gilles POUPON

Publication date: April 10, 2016, Review date: February 21, 2023

You do not have access to this resource.
Click here to request your free trial access!

Already subscribed? Log in!


Français

2. Assembly and interconnection categories

Circuit assembly is the first step after substrate fabrication and cutting. It is defined as the process of electrically connecting the chip's input/output (I/O) pads. Assembly consists of three parts:

  • the chip's metal stud,

  • a metal connecting element between the chip and its substrate,

  • the metal stud on the package.

At the interface between chip and system, this assembly must meet five essential criteria:

  • have "acceptable" electrical properties (in terms of capacitance, resistance and inductance),

  • be a low-cost solution,

  • be easy to industrialize and have a high manufacturing capacity,

  • be reliable,...

You do not have access to this resource.

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource.
Click here to request your free trial access!

Already subscribed? Log in!


The Ultimate Scientific and Technical Reference

A Comprehensive Knowledge Base, with over 1,200 authors and 100 scientific advisors
+ More than 10,000 articles and 1,000 how-to sheets, over 800 new or updated articles every year
From design to prototyping, right through to industrialization, the reference for securing the development of your industrial projects

This article is included in

Electronics

This offer includes:

Knowledge Base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

Practical Path

Operational and didactic, to guarantee the acquisition of transversal skills

Doc & Quiz

Interactive articles with quizzes, for constructive reading

Subscribe now!

Ongoing reading
Assembly and interconnection categories
Outline