2. Assembly and interconnection categories
Circuit assembly is the first step after substrate fabrication and cutting. It is defined as the process of electrically connecting the chip's input/output (I/O) pads. Assembly consists of three parts:
the chip's metal stud,
a metal connecting element between the chip and its substrate,
the metal stud on the package.
At the interface between chip and system, this assembly must meet five essential criteria:
have "acceptable" electrical properties (in terms of capacitance, resistance and inductance),
be a low-cost solution,
be easy to industrialize and have a high manufacturing capacity,
be reliable,...
Exclusive to subscribers. 97% yet to be discovered!
You do not have access to this resource.
Click here to request your free trial access!
Already subscribed? Log in!
The Ultimate Scientific and Technical Reference
This article is included in
Electronics
This offer includes:
Knowledge Base
Updated and enriched with articles validated by our scientific committees
Services
A set of exclusive tools to complement the resources
Practical Path
Operational and didactic, to guarantee the acquisition of transversal skills
Doc & Quiz
Interactive articles with quizzes, for constructive reading
Assembly and interconnection categories
Bibliography
Publications and reviews
IEEE Transactions on Components, Packaging and Manufacturing Technology, https://www.cpmt.org
Chip Scale Review – Haley Publishing – https://www.chipscalereview.com
Électronique Mag – Tracks and tablets – Éditions Alain...
Events
ECTC (Electronic Components and Technology Conference) organized by IEEE CPMT – http://www.ectc.net
IMAPS International Symposium on Microlectronics http://www.imaps.org
Standards
IPC: Association Connecting Electronics Industries http://www.ipc.org/
JEDEC (Joint Electron Device Engineering Council) – http://www.jedec.org
Directory
International networks – Organizations – Federations – Associations (non-exhaustive list)
ITRS – International Technology Roadmap for Semiconductors – http://www.itrs.net/home.html
iNEMI – International Electronics Manufacturing Initiative – http://www.inemi.org
...Semiconductor market trends
Little by little, the conventional type of individually packaged chips is evolving towards more compact solutions, improving performance and enabling greater functionality. Table 1 shows the expected evolution of package type between 2011 and 2018...
Exclusive to subscribers. 97% yet to be discovered!
You do not have access to this resource.
Click here to request your free trial access!
Already subscribed? Log in!
The Ultimate Scientific and Technical Reference