2. Assembly and interconnection categories
Circuit assembly is the first step after substrate fabrication and cutting. It is defined as the process of electrically connecting the chip's input/output (I/O) pads. Assembly consists of three parts:
the chip's metal stud,
a metal connecting element between the chip and its substrate,
the metal stud on the package.
At the interface between chip and system, this assembly must meet five essential criteria:
have "acceptable" electrical properties (in terms of capacitance, resistance and inductance),
be a low-cost solution,
be easy to industrialize and have a high manufacturing capacity,
be reliable,...
The Ultimate Scientific and Technical Reference
This article is included in
Electronics
This offer includes:
Knowledge Base
Updated and enriched with articles validated by our scientific committees
Services
A set of exclusive tools to complement the resources
Practical Path
Operational and didactic, to guarantee the acquisition of transversal skills
Doc & Quiz
Interactive articles with quizzes, for constructive reading
Assembly and interconnection categories
Packaging categories
Bibliography
Publications and reviews
IEEE Transactions on Components, Packaging and Manufacturing Technology, https://www.cpmt.org
Chip Scale Review – Haley Publishing – https://www.chipscalereview.com
Électronique Mag – Tracks and tablets – Éditions Alain...
Events
ECTC (Electronic Components and Technology Conference) organized by IEEE CPMT – http://www.ectc.net
IMAPS International Symposium on Microlectronics http://www.imaps.org
Standards
IPC: Association Connecting Electronics Industries http://www.ipc.org/
JEDEC (Joint Electron Device Engineering Council) – http://www.jedec.org
Directory
International networks – Organizations – Federations – Associations (non-exhaustive list)
ITRS – International Technology Roadmap for Semiconductors – http://www.itrs.net/home.html
iNEMI – International Electronics Manufacturing Initiative – http://www.inemi.org
...Semiconductor market trends
Little by little, the conventional type of individually packaged chips is evolving towards more compact solutions, improving performance and enabling greater functionality. Table 1 shows the expected evolution of package type between 2011 and 2018...
The Ultimate Scientific and Technical Reference
