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6. Conclusion
As long as electronic components, subsystems and systems continue to evolve, packaging and interconnection processes will have to adapt. Furthermore, in a connected, protected and communicating society, the growing number of high-performance microsystems operating in specific environments will guide the roadmap in terms of protection (packaging) and communication (interconnections).
Reduced manufacturing costs, shorter time-to-market, miniaturization (smaller components, multiple levels of integration), increased functionality and enhanced performance are all criteria that need to be taken into account. In the years to come, wafer-level integrated packaging technologies and 3D integration will be the main developments to meet market needs, but as each product requires a tailored technological solution, technology chains will continue to flourish, taking into account...
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Conclusion
Glossary
Bibliography
Publications and reviews
IEEE Transactions on Components, Packaging and Manufacturing Technology, https://www.cpmt.org
Chip Scale Review – Haley Publishing – https://www.chipscalereview.com
Électronique Mag – Tracks and tablets – Éditions Alain...
Events
ECTC (Electronic Components and Technology Conference) organized by IEEE CPMT – http://www.ectc.net
IMAPS International Symposium on Microlectronics http://www.imaps.org
Standards
IPC: Association Connecting Electronics Industries http://www.ipc.org/
JEDEC (Joint Electron Device Engineering Council) – http://www.jedec.org
Directory
International networks – Organizations – Federations – Associations (non-exhaustive list)
ITRS – International Technology Roadmap for Semiconductors – http://www.itrs.net/home.html
iNEMI – International Electronics Manufacturing Initiative – http://www.inemi.org
...Semiconductor market trends
Little by little, the conventional type of individually packaged chips is evolving towards more compact solutions, improving performance and enabling greater functionality. Table 1 shows the expected evolution of package type between 2011 and 2018...
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