Article | REF: E3401 V1

Packaging and interconnection processes for electronics components

Author: Gilles POUPON

Publication date: April 10, 2016, Review date: February 21, 2023

You do not have access to this resource.
Click here to request your free trial access!

Already subscribed? Log in!


Français

5. 3D integration

5.1 Issues

One of the challenges facing the semiconductor industry is to respond simultaneously to the race for integration, improved performance and lower costs. These challenges have guided the roadmaps of the main foundries, and have led to major technological advances. For example, the reduction in the size of components has made it possible to increase speed of execution and improve the performance of components predicted by Moore's Law (performance doubles every 18 months); we are now able to manufacture chips with more than a billion transistors.

3D (three-dimensional) integration allows us to go beyond Moore's Law for components. This technology, which consists in stacking components, allows systems to be miniaturized and interconnection densities to...

You do not have access to this resource.

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource.
Click here to request your free trial access!

Already subscribed? Log in!


The Ultimate Scientific and Technical Reference

A Comprehensive Knowledge Base, with over 1,200 authors and 100 scientific advisors
+ More than 10,000 articles and 1,000 how-to sheets, over 800 new or updated articles every year
From design to prototyping, right through to industrialization, the reference for securing the development of your industrial projects

This article is included in

Electronics

This offer includes:

Knowledge Base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

Practical Path

Operational and didactic, to guarantee the acquisition of transversal skills

Doc & Quiz

Interactive articles with quizzes, for constructive reading

Subscribe now!

Ongoing reading
3D integration
Outline