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1. Background and challenges
1.1 The role of packaging
Microelectronic chip packaging establishes the interconnections and environment required by integrated circuits to process or store information. In fact, it corresponds to the first packaging level of a conventional microelectronic system. For further information, please refer to
electronics, which...
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Background and challenges
Assembly processes
Bibliography
Websites
JEDEC ( http://www.jedec.org ) and daily newsletter (Jedec.SmartBrief)
Electronic Journal ( http://www.electroniques.biz , by subscription) and free daily newsletter
Events
Events organized by IMAPS France, including the MiNaPAD forum (Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum, held in Grenoble).
Events organized by SEMI-Europe (including SEMICON-Europa, usually in Munich in autumn)
Standards and norms
Jedec standards available on the website ( https://ww.jedec.org ) for microelectronic components, including :
J-STD-020 Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for nonhermetic surface-mount devices.
Directory
The community of specialists in electronic assembly packaging has set up a worldwide learned society that publishes reference works and journals, and organizes regular congresses on a continental or national scale. Please contact :
IMAPS (International Microelectronics and Packaging Society) : http://www.imaps.org
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Statistical and economic data
Table 1 gives a more detailed picture of integrated circuit production by package type, and the trend forecast for the near future.
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