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6. Thermal performance
Integrated circuits are imperfect components, so their operation generates a flow of heat. Thermal problems therefore remain a central concern for packaging specialists. The heat flux dissipated by an integrated circuit can exceed 10 6 W.m -2 . Such a flux is far greater than that of an iron (around 500 W.m -2 ). The performance of an integrated circuit decreases markedly with its operating temperature; a CMOS circuit sees its switching time affected by around 3% if its temperature rises by 10°C. Operating temperature also has an influence on component reliability: to a first approximation, the failure rate doubles for every 10°C increase in temperature. The task of thermal engineers is therefore to take these constraints into account, in order to maintain...
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Thermal performance
Assembly reliability
Bibliography
Websites
JEDEC ( http://www.jedec.org ) and daily newsletter (Jedec.SmartBrief)
Electronic Journal ( http://www.electroniques.biz , by subscription) and free daily newsletter
Events
Events organized by IMAPS France, including the MiNaPAD forum (Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum, held in Grenoble).
Events organized by SEMI-Europe (including SEMICON-Europa, usually in Munich in autumn)
Standards and norms
Jedec standards available on the website ( https://ww.jedec.org ) for microelectronic components, including :
J-STD-020 Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for nonhermetic surface-mount devices.
Directory
The community of specialists in electronic assembly packaging has set up a worldwide learned society that publishes reference works and journals, and organizes regular congresses on a continental or national scale. Please contact :
IMAPS (International Microelectronics and Packaging Society) : http://www.imaps.org
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Statistical and economic data
Table 1 gives a more detailed picture of integrated circuit production by package type, and the trend forecast for the near future.
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