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4. Boxes
We've chosen to present the main assembly stages and interconnection supports before turning to packages, which remain the usual means of encapsulating integrated circuits. Historically, a package contains only one integrated circuit chip. However, it is becoming increasingly common to encapsulate several integrated circuits, as well as passive components (capacitors, resistors, etc.) to achieve a complete function, and to give this assembly the form of a package. Moreover, the emergence of a new family of packages never, or only very gradually, replaces existing packages, but rather contributes to the growth of the microelectronics market; this is the case, for example, of insertion packages, the first type of package to be developed (DIP packages in figure
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Boxes
Electrical performance of assemblies
Bibliography
Websites
JEDEC ( http://www.jedec.org ) and daily newsletter (Jedec.SmartBrief)
Electronic Journal ( http://www.electroniques.biz , by subscription) and free daily newsletter
Events
Events organized by IMAPS France, including the MiNaPAD forum (Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum, held in Grenoble).
Events organized by SEMI-Europe (including SEMICON-Europa, usually in Munich in autumn)
Standards and norms
Jedec standards available on the website ( https://ww.jedec.org ) for microelectronic components, including :
J-STD-020 Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for nonhermetic surface-mount devices.
Directory
The community of specialists in electronic assembly packaging has set up a worldwide learned society that publishes reference works and journals, and organizes regular congresses on a continental or national scale. Please contact :
IMAPS (International Microelectronics and Packaging Society) : http://www.imaps.org
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Statistical and economic data
Table 1 gives a more detailed picture of integrated circuit production by package type, and the trend forecast for the near future.
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