Article | REF: E3400 V3

Integrated Circuits packaging

Author: Jean-Luc DIOT

Publication date: September 10, 2024

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2. Assembly processes

To design and produce an electronic assembly, the specialist needs both interconnection supports and assembly processes. It is the combination of interconnection media and assembly processes that guarantees the final result and the best compromise between the many, often contradictory, constraints to which an electronic assembly must respond. When designing an electronic assembly, all these constraints must be taken into account in a uniform manner.

In this chapter, we describe the major stages of conventional processes for assembling an integrated circuit chip on an interconnection support (§ 3

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Assembly processes