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3. Interconnection supports
3.1 Principle
Strictly speaking, an interconnection support is a set of insulated conductive lines that represent a pattern of electrical connections between electronic elements within the same sub-assembly. As a rule, the interconnection support also has a purely mechanical holding role for these elements.
Packages interconnect ever denser integrated circuits (with more and more output pads), via interconnect carriers whose relative density is ever lower. In short, packaging is above all a pitch transformer; indeed, the pitches of a semiconductor's output pads are between 35 and 200 µm, whereas the pad pitches used on a printed circuit board are of the order of several tenths of a millimetre for the most common cases. Furthermore, for obvious cost reasons,...
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Interconnection supports
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Bibliography
Websites
JEDEC ( http://www.jedec.org ) and daily newsletter (Jedec.SmartBrief)
Electronic Journal ( http://www.electroniques.biz , by subscription) and free daily newsletter
Events
Events organized by IMAPS France, including the MiNaPAD forum (Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum, held in Grenoble).
Events organized by SEMI-Europe (including SEMICON-Europa, usually in Munich in autumn)
Standards and norms
Jedec standards available on the website ( https://ww.jedec.org ) for microelectronic components, including :
J-STD-020 Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for nonhermetic surface-mount devices.
Directory
The community of specialists in electronic assembly packaging has set up a worldwide learned society that publishes reference works and journals, and organizes regular congresses on a continental or national scale. Please contact :
IMAPS (International Microelectronics and Packaging Society) : http://www.imaps.org
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Statistical and economic data
Table 1 gives a more detailed picture of integrated circuit production by package type, and the trend forecast for the near future.
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