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1. Background and challenges
1.1 The role of packaging
Microelectronic chip packaging establishes the interconnections and environment required for integrated circuits to process or store information. It is in fact the first level of packaging for a conventional microelectronic system. For more information, please refer to
electronics, which deals with...
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Background and challenges
Assembly processes
Bibliography
Websites
JEDEC ( http://www.jedec.org ) and daily newsletter (Jedec.SmartBrief)
Electronic journals ( http://www.electroniques.biz , by subscription) and free daily newsletter
Events
Events organized by IMAPS France, including the MiNaPAD forum (Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum, held in Grenoble).
Events organized by SEMI-Europe (including SEMICON-Europa, usually held in Munich in autumn)
Standards and norms
Jedec standards available on the website ( https://ww.jedec.org ) for microelectronic components, including :
- Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for nonhermetic surface-mount devices. - J-STD-020 -
Directory
The community of specialists in electronic assembly packaging has set up a worldwide learned society that publishes reference works and journals, and organizes regular congresses on a continental or national scale. Please contact :
IMAPS (International Microelectronics and Packaging Society) : http://www.imaps.org
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Statistical and economic data
Table 1 gives a more detailed picture of integrated circuit production by package type, and the trend forecast for the near future.
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