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2. Assembly processes
To design and produce an electronic assembly, the specialist needs both interconnection supports and assembly processes. It is the combination of interconnection media and assembly processes that guarantees the final result and the best compromise between the many, often contradictory, constraints that an electronic assembly must meet. When designing an electronic assembly, all these constraints must be taken into account in a uniform manner.
In this chapter, we describe the main stages in the assembly of an integrated circuit chip on an interconnection support (§ 3
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Assembly processes
Interconnection supports
Bibliography
Websites
JEDEC ( http://www.jedec.org ) and daily newsletter (Jedec.SmartBrief)
Electronic journals ( http://www.electroniques.biz , by subscription) and free daily newsletter
Events
Events organized by IMAPS France, including the MiNaPAD forum (Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum, held in Grenoble).
Events organized by SEMI-Europe (including SEMICON-Europa, usually held in Munich in autumn)
Standards and norms
Jedec standards available on the website ( https://ww.jedec.org ) for microelectronic components, including :
- Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for nonhermetic surface-mount devices. - J-STD-020 -
Directory
The community of specialists in electronic assembly packaging has set up a worldwide learned society that publishes reference works and journals, and organizes regular congresses on a continental or national scale. Please contact :
IMAPS (International Microelectronics and Packaging Society) : http://www.imaps.org
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Statistical and economic data
Table 1 gives a more detailed picture of integrated circuit production by package type, and the trend forecast for the near future.
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