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9. Glossary
ball
Bille.
bossages; bumps
A deposit that allows contact to be made with a ball.
bumping
boss.
chip ; die
Chip.
flip chip
Flip chip.
interpose
Intermediate chip used as a mechanical wedge or which can accommodate chips on either side and is fitted with through-holes.
electronic module
Several electronic components interconnected and assembled.
pillar bumps
Interconnections often surmounted by fusible material (usually copper) to ensure soldering.
remelting
Technical sequence...
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Glossary
Acronyms and symbols
Bibliography
Websites
JEDEC ( http://www.jedec.org ) and daily newsletter (Jedec.SmartBrief)
Electronic journals ( http://www.electroniques.biz , by subscription) and free daily newsletter
Events
Events organized by IMAPS France, including the MiNaPAD forum (Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum, held in Grenoble).
Events organized by SEMI-Europe (including SEMICON-Europa, usually held in Munich in autumn)
Standards and norms
Jedec standards available on the website ( https://ww.jedec.org ) for microelectronic components, including :
- Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for nonhermetic surface-mount devices. - J-STD-020 -
Directory
The community of specialists in electronic assembly packaging has set up a worldwide learned society that publishes reference works and journals, and organizes regular congresses on a continental or national scale. Please contact :
IMAPS (International Microelectronics and Packaging Society) : http://www.imaps.org
...
Statistical and economic data
Table 1 gives a more detailed picture of integrated circuit production by package type, and the trend forecast for the near future.
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