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7. Assembly reliability
The reliability of an object is assessed by the length of time it fulfills the function for which it was built. The level of reliability required by an electronic assembly obviously depends on the field of application.
we'll put up with the failure of a TV set, whereas the failure of a pacemaker can have tragic consequences. In the IT sector, the loss of data (or availability) can have extremely serious financial consequences.
As a result, methods for assessing package reliability vary widely. Without going into the theoretical concepts, described in the article
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Assembly reliability
Conclusion
Bibliography
Websites
JEDEC ( http://www.jedec.org ) and daily newsletter (Jedec.SmartBrief)
Electronic journals ( http://www.electroniques.biz , by subscription) and free daily newsletter
Events
Events organized by IMAPS France, including the MiNaPAD forum (Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum, held in Grenoble).
Events organized by SEMI-Europe (including SEMICON-Europa, usually held in Munich in autumn)
Standards and norms
Jedec standards available on the website ( https://ww.jedec.org ) for microelectronic components, including :
- Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for nonhermetic surface-mount devices. - J-STD-020 -
Directory
The community of specialists in electronic assembly packaging has set up a worldwide learned society that publishes reference works and journals, and organizes regular congresses on a continental or national scale. Please contact :
IMAPS (International Microelectronics and Packaging Society) : http://www.imaps.org
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Statistical and economic data
Table 1 gives a more detailed picture of integrated circuit production by package type, and the trend forecast for the near future.
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