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8. Conclusion
Packaging has accompanied the evolution of microelectronics applications, from the infrastructure electronics of the 80s to today's mobile applications. New applications don't replace existing markets and, consequently, new packages don't replace existing ones; for example, generic SMD packages (SO or LQFP type) will continue to endure for decades.
The Internet of Things (IoT) is set to take up where mobile applications left off, first with the cell phone and then the smartphone. Weight reduction and greater integration will therefore continue to be key trends. This should not, however, translate into a reduction in package output pitches. Indeed, pitches of between 0.35 and 0.5mm seem to be the limit to avoid increasing PCB prices too much. On the other hand, the reduction in case thickness is likely to be more pronounced, with the integration of passives or simple...
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Conclusion
Glossary
Bibliography
Websites
JEDEC ( http://www.jedec.org ) and daily newsletter (Jedec.SmartBrief)
Electronic journals ( http://www.electroniques.biz , by subscription) and free daily newsletter
Events
Events organized by IMAPS France, including the MiNaPAD forum (Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum, held in Grenoble).
Events organized by SEMI-Europe (including SEMICON-Europa, usually held in Munich in autumn)
Standards and norms
Jedec standards available on the website ( https://ww.jedec.org ) for microelectronic components, including :
- Joint IPC/JEDEC standard for moisture/reflow sensitivity classification for nonhermetic surface-mount devices. - J-STD-020 -
Directory
The community of specialists in electronic assembly packaging has set up a worldwide learned society that publishes reference works and journals, and organizes regular congresses on a continental or national scale. Please contact :
IMAPS (International Microelectronics and Packaging Society) : http://www.imaps.org
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Statistical and economic data
Table 1 gives a more detailed picture of integrated circuit production by package type, and the trend forecast for the near future.
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