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7. Plastic packaging challenges
Innovations must constantly respond to new performance requirements and new constraints (ecological, for example).
7.1 Switch to lead-free process
The RoHS directive, whose main impact on electronic boards is the disappearance of SnPb solder in favor of an alloy with a higher melting point, has seriously shaken the whole edifice built on the properties of lead alloy.
The remelting profile of the new alloy (generally tin-silver-copper, SnAgCu) requires, among other things, materials that can withstand high temperatures (up to 260°C), the reclassification of housings with regard to the risk of delamination during deferral, and modified designs to take account of the deformation of large housings.
In addition, as...
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Plastic packaging challenges
Conclusion
Bibliography
In Engineering Techniques
Websites
To access JEDEC standards and publications http://www.jedec.org
For information on RoHS and lead-free products http://www.lead-free.org
Website of the INEMI association of manufacturers and equipment suppliers
Standards and norms
- Registered and standard outlines for solid state and related products - JEDEC 95 -
Standards for testing
- Essai d'endurance en stockage JESD22-A103 High Temperature Storage Test MIL STD 883 method 1008 - HTB (High Temperature Bake) -
- Essai d'endurance en fonctionnement pour CIs JESD22-A108 Bias Life MIL STD 883 method 1005 (steady state life) - HTOL (High Temperature Operating Life) - ...
Regulations
RoHS Directive 2002/95/EC EU directive on Restriction on the use of Hazardous Substances (RoHS).
Directory
Manufacturers
The most important manufacturers of component encapsulation resins are :
...Statistical and economic data
The breakdown of enclosure families (by volume) is shown in figure (2010 estimate based on data from Electronic Trend Publications).
PDIPs are still present. In percentage terms, traditional pin-type packages (SO, TSOP, QFP) are slowly declining in world production, but remain in the majority. Ball bearing packages (BGA, CSP) and tabless packages (QFN) account for...
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