Français
2. Manufacture of plastic housings
2.1 Encapsulation market
Major manufacturers generally have their own in-house assembly plants. However, they also partially subcontract assembly, and even final electrical testing, in order to better manage variations in demand and devote themselves to higher value-added products. In this way, they retain the ability to innovate in-house, and stay one step ahead in terms of housing development.
Smaller manufacturers, and some so-called "fabless" manufacturers specializing in complex circuit design, use subcontractors exclusively for component assembly. Package development is then carried out in partnership with the subcontractor, the largest of whom (such as Amkor Technology, ASE Global, STATS ChipPAC and SPIL) compete with the major manufacturers in this field....
The Ultimate Scientific and Technical Reference
This article is included in
Electronics
This offer includes:
Knowledge Base
Updated and enriched with articles validated by our scientific committees
Services
A set of exclusive tools to complement the resources
Practical Path
Operational and didactic, to guarantee the acquisition of transversal skills
Doc & Quiz
Interactive articles with quizzes, for constructive reading
Manufacture of plastic housings
Advantages of plastic encapsulation
Bibliography
In Engineering Techniques
Websites
To access JEDEC standards and publications http://www.jedec.org
For information on RoHS and lead-free products http://www.lead-free.org
Website of the INEMI association of manufacturers and equipment suppliers
Standards and norms
- Registered and standard outlines for solid state and related products - JEDEC 95 -
Standards for testing
- Essai d'endurance en stockage JESD22-A103 High Temperature Storage Test MIL STD 883 method 1008 - HTB (High Temperature Bake) -
- Essai d'endurance en fonctionnement pour CIs JESD22-A108 Bias Life MIL STD 883 method 1005 (steady state life) - HTOL (High Temperature Operating Life) - ...
Regulations
RoHS Directive 2002/95/EC EU directive on Restriction on the use of Hazardous Substances (RoHS).
Directory
Manufacturers
The most important manufacturers of component encapsulation resins are :
...Statistical and economic data
The breakdown of enclosure families (by volume) is shown in figure (2010 estimate based on data from Electronic Trend Publications).
PDIPs are still present. In percentage terms, traditional pin-type packages (SO, TSOP, QFP) are slowly declining in world production, but remain in the majority. Ball bearing packages (BGA, CSP) and tabless packages (QFN) account for...
The Ultimate Scientific and Technical Reference
