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4. Limitations of plastic packaging
In this section, we will list the properties that show the limitations of plastics for encapsulation. The solutions developed to overcome these "weaknesses" will be described in paragraph .
4.1 Water permeability
The first defect attributed to plastic housings is their permeability to water, or even sealing defects between the resin and metal conductors, whereas hermetic housings totally isolate the semiconductor from the outside environment. The moisture permeability of resins allows water to reach the surface of semiconductors, leading to severe corrosion of the metallized areas on early versions of plastic housings, which caused serious problems in US military equipment subjected to tropical environments in the early 1970s. This setback...
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Limitations of plastic packaging
Related solutions
Bibliography
In Engineering Techniques
Websites
To access JEDEC standards and publications http://www.jedec.org
For information on RoHS and lead-free products http://www.lead-free.org
Website of the INEMI association of manufacturers and equipment suppliers
Standards and norms
- Registered and standard outlines for solid state and related products - JEDEC 95 -
Standards for testing
- Essai d'endurance en stockage JESD22-A103 High Temperature Storage Test MIL STD 883 method 1008 - HTB (High Temperature Bake) -
- Essai d'endurance en fonctionnement pour CIs JESD22-A108 Bias Life MIL STD 883 method 1005 (steady state life) - HTOL (High Temperature Operating Life) - ...
Regulations
RoHS Directive 2002/95/EC EU directive on Restriction on the use of Hazardous Substances (RoHS).
Directory
Manufacturers
The most important manufacturers of component encapsulation resins are :
...Statistical and economic data
The breakdown of enclosure families (by volume) is shown in figure (2010 estimate based on data from Electronic Trend Publications).
PDIPs are still present. In percentage terms, traditional pin-type packages (SO, TSOP, QFP) are slowly declining in world production, but remain in the majority. Ball bearing packages (BGA, CSP) and tabless packages (QFN) account for...
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