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8. Conclusion
Plastic packaging for integrated circuits has become indispensable, thanks to its price/integration/automation advantages and its ability to adapt to ever-changing equipment requirements. For a long time to come, there will continue to be applications that justify the use of simple, robust housings. But, just as the development of modern components can no longer dissociate chip and encapsulation design, the development of equipment is increasingly blending package and printed circuit board technologies to the point where it is no longer possible to distinguish where the boundaries lie.
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Conclusion
Bibliography
In Engineering Techniques
Websites
To access JEDEC standards and publications http://www.jedec.org
For information on RoHS and lead-free products http://www.lead-free.org
Website of the INEMI association of manufacturers and equipment suppliers
Standards and norms
- Registered and standard outlines for solid state and related products - JEDEC 95 -
Standards for testing
- Essai d'endurance en stockage JESD22-A103 High Temperature Storage Test MIL STD 883 method 1008 - HTB (High Temperature Bake) -
- Essai d'endurance en fonctionnement pour CIs JESD22-A108 Bias Life MIL STD 883 method 1005 (steady state life) - HTOL (High Temperature Operating Life) - ...
Regulations
RoHS Directive 2002/95/EC EU directive on Restriction on the use of Hazardous Substances (RoHS).
Directory
Manufacturers
The most important manufacturers of component encapsulation resins are :
...Statistical and economic data
The breakdown of enclosure families (by volume) is shown in figure (2010 estimate based on data from Electronic Trend Publications).
PDIPs are still present. In percentage terms, traditional pin-type packages (SO, TSOP, QFP) are slowly declining in world production, but remain in the majority. Ball bearing packages (BGA, CSP) and tabless packages (QFN) account for...
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