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6. Life cycle of encapsulation technologies
As with all technologies, processes and materials evolve, and product families disappear to be replaced by other, ever more high-performance families. However, package families have relatively long lifespans compared to the circuits they encapsulate. For example, the PDIP package, developed before 1970, is still in production, even though it has been considered end-of-life for many years. The lifespan of SOs will exceed 25 years, while that of some more recent packages will probably be close to 20 years.
The technological evolution of enclosures is driven by volume markets, for which integration is a predominant factor, i.e. today's microcomputers and cell phones, digital cameras... This momentum is leading to the disappearance of older technologies, for reasons of production cost (linked to the volume produced) and the OEM's interest in using these technologies...
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Life cycle of encapsulation technologies
Plastic packaging challenges
Bibliography
In Engineering Techniques
Websites
To access JEDEC standards and publications http://www.jedec.org
For information on RoHS and lead-free products http://www.lead-free.org
Website of the INEMI association of manufacturers and equipment suppliers
Standards and norms
- Registered and standard outlines for solid state and related products - JEDEC 95 -
Standards for testing
- Essai d'endurance en stockage JESD22-A103 High Temperature Storage Test MIL STD 883 method 1008 - HTB (High Temperature Bake) -
- Essai d'endurance en fonctionnement pour CIs JESD22-A108 Bias Life MIL STD 883 method 1005 (steady state life) - HTOL (High Temperature Operating Life) - ...
Regulations
RoHS Directive 2002/95/EC EU directive on Restriction on the use of Hazardous Substances (RoHS).
Directory
Manufacturers
The most important manufacturers of component encapsulation resins are :
...Statistical and economic data
The breakdown of enclosure families (by volume) is shown in figure (2010 estimate based on data from Electronic Trend Publications).
PDIPs are still present. In percentage terms, traditional pin-type packages (SO, TSOP, QFP) are slowly declining in world production, but remain in the majority. Ball bearing packages (BGA, CSP) and tabless packages (QFN) account for...
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