Overview
FrançaisABSTRACT
The PCBs are designed with increased complexity which causes EMC and signal integrity (SI) effects. To overcome such effects, simulation and modelling methodology must be developed. The EMC method depends on the elaboration of PCB equivalent circuits performed during the design phase. The present article develops a simulation and modelling methodology of mixed circuit inspired from a PCB. The simulation approach deals with the conducted EMC and SI. Conducted EMC emission and susceptibility are investigated. The last section of the article introduces a marginal study of the PCB operation risk.
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Read the articleAUTHORS
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Blaise RAVELO: ESPA Engineer, University of Antsiranana, Madagascar - Master's degree and Doctorate from the Université de Bretagne Occidentale (UBO), - HDR from Rouen University - Professor at NUIST, Nanjing, Jiangsu, China
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Sébastien LALLÉCHÈRE: EMC Research Engineer and PhD from Blaise Pascal University, - HDR from Clermont Auvergne University - SafranTech, Magny-les-Hameaux, France
INTRODUCTION
To meet public needs, the PCB (Printed Circuit Board) design and manufacturing industries are moving towards electronic technology with high-density implementation. Electronics are increasingly required to operate in harsh environments. Like all electrical equipment, PCBs and electronic circuits must systematically meet electromagnetic compatibility (EMC) requirements
However, for all types of equipment, especially PCBs, EMC testing is often costly and time-consuming. To remedy this cost, it is possible to act upstream during the design phase by developing analytical or numerical models of emissions and susceptibilities in radiated and conducted modes. As with experimental tests, there are various types of EMC models. Firstly, there are systemic models, which can be applied to relatively complex circuits. Analytical models of near-field radiation emissions from PCBs can also be considered. Conversely, the influence of EM radiation can also be modeled using analytical coupling functions with PCB elements. Conducted emission and susceptibility models of components are also solutions for equipment manufacturers. For design engineers, all these different models make it possible to predict possible EMC effects before implementation. For PCBs, it is important to point out that it is conceivable to develop techniques to reduce EMC effects, for example by using negative Group Propagation Time (GPT) circuits.
In addition to component EMC models
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KEYWORDS
EMC | simulation | modelling | PCB | conducted emission | conducted susceptibility | signal integrity | analysis methodology
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Methodology for simulating and modeling an electronic board in terms of EMC and signal integrity
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