Overview
ABSTRACT
The electronic boards for the space applications (satellites) require a high level of reliability and a respect for high environmental constraints specific to spatial domain. The article presents the various requirements to be respected in order to guarantee the reliability and to assure the mission. The environments which undergo the electronic boards are detailed in four parts: the requests of mechanical, thermal, EMC and radiations. All these aspects impose technological limitations at the level of raw materials, means and tools. A particular attention will be mentioned on design and the manufacturing processes of the electronic boards including reliability controls.
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David VIALA: Design office manager for electronic boards and digital equipment, - Thales Alenia Space, - Thales, Toulouse, France
INTRODUCTION
For geostationary missions, electronic boards must meet a reliability level of 15 years in flight, in a specific environment in terms of mechanical, thermal, radiation and radiative stress. In addition, storage and conditioning on the ground prior to flight can last several months or even years. This longevity is sometimes limited to a few years for more scientific missions in low, stationary Leo orbits.
What was true in the 2000s, when the small quantities inherent in the space market prevented us from taking advantage of the mass effect needed to introduce new technologies or technological limits, is no longer the case today. Indeed, even if the notion of series does not exist as it does in the automotive or consumer sectors (e.g. mobile telephony), since volumes can be counted in tens of units, it is essential to take new technologies on board, in order to have high-performance electronic equipment that meets customers' needs. Applications range from commercial to military, and include navigation, optics and telecommunications. Satellite operators need flexible, high-capacity in-flight solutions.
Following a description of environmental constraints, the article details the qualification domain for electronic board technologies, which covers three areas:
the basic support, the printed circuit board (PCB);
electronic and non-electronic components assembled on the PCB ;
assembly methods (brazing, gluing, screwing, etc.).
The main design and industrialization rules are illustrated, and compliance with them is essential to guarantee a level of reliability in line with the needs of space missions.
The major points concerning environmental constraints are detailed first. The often iterative development phases are then analyzed. At the end of the document, the main stages in the production of electronic boards are presented, with a focus on controls.
A glossary and table of acronyms are provided at the end of the article.
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KEYWORDS
reliability | manufacturing | PCB | electronic boards design
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Bibliography
Events
Trade fairs :
IPC APEX EXPO (United States)
ELECRONICA (Munich – Germany)
CNES (Centre national d'études spatiales) RT days
Standards and norms
- ECSS standards for PCB. - ECSS-Q-ST-70-60C -
- ECSS standards for system engineering general requirements. - ECC-E-ST-10C -
- MIL standards for test method for Microcircuits. - MIL-STD-883 -
- IPC standards electronics assembly. - IPC-1-610 -
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