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3. Conclusion
The PCB remains a strategic and complex element in electronic equipment. The definition and choice of its stacking are determined by taking into account performance constraints, the environment, and the industrial constraints of manufacturers and assemblers.
Electronic CAD tools evolve in line with technological needs; several million vias and tracks on a board need to be checked automatically, as human verification, even if multiple, does not allow us to see everything.
Among short-term developments, multi-level HDI technology is needed to be able to use components with high interconnect density.
In the medium term, electronic boards for space applications will have to be compatible with non-lead terminated components, increasingly from the consumer market. The transition to completely lead-free manufacturing processes...
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The Ultimate Scientific and Technical Reference
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Systèmes aéronautiques et spatiaux
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Conclusion
Bibliography
Events
Trade fairs :
IPC APEX EXPO (United States)
ELECRONICA (Munich – Germany)
CNES (Centre national d'études spatiales) RT days
Standards and norms
- ECSS standards for PCB. - ECSS-Q-ST-70-60C -
- ECSS standards for system engineering general requirements. - ECC-E-ST-10C -
- MIL standards for test method for Microcircuits. - MIL-STD-883 -
- IPC standards electronics assembly. - IPC-1-610 -
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The Ultimate Scientific and Technical Reference