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1. Environmental constraints
1.1 Mechanical engineering
Electronic equipment is subjected to vibrations when the rocket is launched, and shocks when the satellite is ejected from the nose cone (top of the rocket), as well as when the panels are deployed following the triggering of pyrotechnic bolts. Thermomechanical aspects related to fatigue phenomena are discussed in paragraph 1.3 .
The origin of mechanical stresses results from three consecutive phases:
the launch...
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Environmental constraints
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Standards and norms
- ECSS standards for PCB. - ECSS-Q-ST-70-60C -
- ECSS standards for system engineering general requirements. - ECC-E-ST-10C -
- MIL standards for test method for Microcircuits. - MIL-STD-883 -
- IPC standards electronics assembly. - IPC-1-610 -
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