Overview
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Mathias PEZ: Research engineer at the Thales Central Research Laboratory - Teacher at École Spéciale de Mécanique et d'Électricité (ESME-Sudria) Specialization at École Nationale Supérieure de l'Aéronautique et de l'Espace (SUPAERO)
INTRODUCTION
The ever-increasing complexity and performance of components enables greater integration of electronic functions on a single "chip". With the recent development of digital signal processing techniques, the calculation capacities of components have been considerably increased. This greater computing power implies ever-increasing communication rates between processors, with display screens and towards "sensors". The intrinsic advantages of optics (attenuation, coherence, parallelism, integration, etc.) and its massive use in long-distance communications networks make it an ideal candidate.
This article introduces optical interconnect technologies, their advantages and disadvantages compared with traditional interconnects. After a brief review of the concepts of guided propagation, the reader will be introduced to components suitable for optical interconnects and notions of optoelectronic interface design, so that he or she is able to grasp the different technologies implemented within optoelectronic modules. This article describes the impact of optical interconnections on the physical and software architecture of processing and communication systems. The various passive and active technologies are detailed, leading to the production of integrated modules and their environmental characterization.
In conclusion, the new lines of research will be introduced. Combined with the very strong growth in microelectronics, they should enable optical interconnections to make their mark in the field of communications between boards, between components and eventually within a component itself.
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Optical interconnections
Bibliography
Theoretical references
Theoretical optics
Conferences
Optical Fibre Communication : OFC
European Materials Research Society : E-MRS
Workshop on Optical Communications and Computer Sciences : WOCCS
Lasers and Electro-Optics Society : LEOS
Electronic Components and Technology Conference : ECTC
International Electronic Packaging Technical Conference : InterPack...
Standards and standardization bodies
In the field of optical interconnections, we find most of the standardization bodies in the world of electronics and microelectronics. Examples include :
Union technique de l'électricité (UTE);
International Electrotechnical Commission (IEC);
Laboratoire Central des Industries Electriques...
Financial organizations and players
Manufacturers, national governments and universities are all involved in the development of optical interconnections, over the longer or shorter term depending on the commercial or technological nature of their objectives. R&D is largely focused on the development of complete, integrated systems, using technological options and materials such as VCSELs for transmitters, fibers for box-to-box connectors,...
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