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4. Research areas and long-term trends
A number of technological challenges need to be overcome to lower costs and increase the viability of optical interconnections. Higher transmission rates require integrated and/or wavelength-multiplexed transmitters and receivers. Increased link parallelism leads to the development of VCSEL arrays and smart pixels (combining transmitter and receiver on the same chip), and the use of fiber bundles or free-space interconnects. The need for integrated communication modules calls for the new alignment, assembly, encapsulation and heterogeneous integration techniques developed below.
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Research areas and long-term trends
Bibliography
Theoretical references
Theoretical optics
Conferences
Optical Fibre Communication : OFC
European Materials Research Society : E-MRS
Workshop on Optical Communications and Computer Sciences : WOCCS
Lasers and Electro-Optics Society : LEOS
Electronic Components and Technology Conference : ECTC
International Electronic Packaging Technical Conference : InterPack...
Standards and standardization bodies
In the field of optical interconnections, we find most of the standardization bodies in the world of electronics and microelectronics. Examples include :
Union technique de l'électricité (UTE);
International Electrotechnical Commission (IEC);
Laboratoire Central des Industries Electriques...
Financial organizations and players
Manufacturers, national governments and universities are all involved in the development of optical interconnections, over the longer or shorter term depending on the commercial or technological nature of their objectives. R&D is largely focused on the development of complete, integrated systems, using technological options and materials such as VCSELs for transmitters, fibers for box-to-box connectors,...
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