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1. 2D power module
The packaging of the power module is the close environment of the semiconductor chips. It must meet certain conditions to ensure the correct operation of the chips:
mechanical resistance: the packaging must protect the chip from moisture, dust and static electricity . It protects it mechanically by means of a cover, usually made of plastic;
thermal management: the packaging must provide a path of low thermal resistance to evacuate as much as possible of the heat dissipated by the chip(s)...
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2D power module
Bibliography
Bibliography
Directory
Manufacturers – Suppliers – Distributors (non-exhaustive list)
Brazing :
ESL Europe http://www.esleurope.co.uk
Indium Corporation http://www.indium.com
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The Ultimate Scientific and Technical Reference