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6. Wiring wire
The power module's internal electrical connections, on semiconductor chips in particular, are generally made using Wire Bonding technology. These are wiring wires with a diameter of between 100 and 500 μm (figure 20 a) . They are generally made either of aluminum, combined, in proportions of a few ppm, with alloys that reduce the risk of aluminum corrosion (nickel) or increase its hardening (silicon or magnesium), or of gold. To avoid the formation...
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Wiring wire
Bibliography
Bibliography
Directory
Manufacturers – Suppliers – Distributors (non-exhaustive list)
Brazing :
ESL Europe http://www.esleurope.co.uk
Indium Corporation http://www.indium.com
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The Ultimate Scientific and Technical Reference