8. Encapsulation

The encapsulation of a power module contributes to meeting the mechanical and chemical protection requirements of packaging. Its purpose is to ensure the power module's dielectric strength, and to protect the semiconductor chips and assembly from external aggression (humidity, contamination, etc.). It also reinforces electrical insulation between conductors, and improves resistance to partial discharges caused by defects in the metallization of DBC-type substrates. It is designed in two parts (figure 1...

You do not have access to this resource.

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource.
Click here to request your free trial access!

Already subscribed? Log in!

The Ultimate Scientific and Technical Reference

A Comprehensive Knowledge Base, with over 1,200 authors and 100 scientific advisors

+ More than 10,000 articles and 1,000 how-to sheets, over 800 new or updated articles every year

From design to prototyping, right through to industrialization, the reference for securing the development of your industrial projects

This article is included in

Electronics

This offer includes:

Knowledge Base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

Practical Path

Operational and didactic, to guarantee the acquisition of transversal skills

Doc & Quiz

Interactive articles with quizzes, for constructive reading

Subscribe now!

Ongoing reading
Encapsulation

Previous
page Electrical terminal

3D interconnection technologies

Bibliography

(1) - MASSON (A.), SABBAH (W.), RIVA (R.), BUTTAY (C.), AZZOPARDI (S.), MOREL (H.), PLANSON (D.), MEURET (R.) - Die attach using silver sintering. Practical implementation and analysis. - European Journal of Electrical Engineering, vol. 16, n° 13-14, p. 293-305, août 2013.
...