Article | REF: E3342 V2

Design and manufacture of rigid printed circuit boards

Author: Eric CADALEN

Publication date: November 10, 2013, Review date: January 5, 2021

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6. Developments

The aim of these developments is to improve reliability or electrical or thermal performance. It's the applications that drive industrial developments, even if it's basically the processes and materials that need to be adapted.

6.1 Materials

There are many possible ways of classifying materials. The basic characteristics have been listed with the most common materials.

These properties correspond to grades commonly used and deployed by NEMA in particular, and synthesized in the IPC-4101 standard (specification of base materials for rigid and multilayer printed circuits). The IPC-4101 is regularly updated with new references, including the latest developments in "lead-free".

These characteristics can be detailed...

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