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7. Conclusion
The integration of capacitors (paragraph 6.2.2.2) and, more generally, of active silicon circuits can be achieved using several advanced methods which are currently being developed and introduced into production. The "embedded die" method is in fact a sum of technological adaptations. The interconnection to the integrated circuit is made via a microvia optimized to fit the integrated circuit's inputs and outputs. This optimized connection is achieved using excimer laser drilling and LDI photolithography processes.
A printed circuit board with components that used to be surface-mounted is now being developed for volume integration. This technological brick is to be added to the other bricks that are redesigning printed circuit technology today. These include the integration of optical functions or microfluidic channels... These bricks open up new perspectives and...
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Conclusion
Bibliography
Software tools and websites
http://electronique-mag. com piste et pastilles magazine website dedicated to printed circuit boards.
http://ipc-2581.com/ PCB data exchange file description site
Regulations
RoHS Directive: Directive 2011/65/EU of the European Parliament and of the Council of June 08, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS: Restriction of Hazardous Substances).
WEEE Directive 2012/19/EU of the European Parliament and Council of July 04, 2012 on waste electrical and electronic equipment (WEEE: Waste Electrical and...
Events
IFTEC training courses in printed circuit board technology : http://www.iftec.fr.
Standards and norms
The French NF 93713 and European UTE 93703 standards, although still in use and valid for standard printed circuit boards, are no longer updated for advanced processes, and have been superseded by the American IPC standards ( http://www.ipc.org ): The institute for interconnecting and packaging Electronic circuits.
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