Article | REF: R2745 V1

Infrared thermography and experimental analysis in mechanical engineering

Author: Minh Phong LUONG

Publication date: June 10, 2016, Review date: March 24, 2022

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1. Thermomechanical coupling in solids

The thermal effects developed by thermomechanical coupling [AF 5 042] in materials and structures have traditionally been neglected in thermal stress analysis. The temperature field and the deformation induced by thermal expansion and mechanical loads have often been solved separately. However, these effects could become significant when mass inertia is no longer negligible, due to the heat flux developed across the body boundary, or if the material is stressed beyond its reversible stability limit. The relevance of coupled thermomechanical analysis has been demonstrated for a wide variety of problems,...

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Thermomechanical coupling in solids