1. Context

During the sputtering process [IN 207] , positive plasma ions (e.g. Ar ⁺ ) are accelerated towards the negatively polarized cathode surface. Attached to the cathode is a target whose surface atoms are ejected as a result of ion bombardment. Sputtering of the target generates a vapour of metal atoms which condense on the surrounding surfaces, particularly the substrate. This process makes it possible to synthesize a very large number of materials in the form of thin films (< 1 μm), whether metals, alloys or compounds such as metal oxides, nitrides, carbides, etc.