1. Home
  2. Electronic-photonic
  3. Electronics
  4. Microelectronic sensors

  5. Collective micro-machining technology

Article | REF: E3093 V1

Microelectronic sensors

Authors: Alfred PERMUY, Éric DONZIER, Fadhel REZGUI

Publication date: May 10, 2004, Review date: November 29, 2019

You do not have access to this resource.
Click here to request your free trial access!

Already subscribed? Log in!

Français

2. Collective micro-machining technology

2.1 General features

Structures exploiting the mechanical and elastic properties of materials are usually referred to as micromachined. They generally comprise at least one flexible element (beam, bridge or membrane) and are produced by deep chemical or physico-chemical etching (often in excess of 100 µm). The purpose of these etchings is to isolate elastic structures within a material of the same nature (usually silicon) or of a different nature (for example, creating a polysilicon beam by etching away an underlying oxide layer).

You do not have access to this resource.

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource.
Click here to request your free trial access!

Already subscribed? Log in!

The Ultimate Scientific and Technical Reference

A Comprehensive Knowledge Base, with over 1,200 authors and 100 scientific advisors
+ More than 10,000 articles and 1,000 how-to sheets, over 800 new or updated articles every year
From design to prototyping, right through to industrialization, the reference for securing the development of your industrial projects

This article is included in

Electronics

This offer includes:

Knowledge Base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

Practical Path

Operational and didactic, to guarantee the acquisition of transversal skills

Doc & Quiz

Interactive articles with quizzes, for constructive reading

Subscribe now!

Ongoing reading
Collective micro-machining technology
Outline