Article | REF: E3952 V1

Heat dissipation in electronic systems

Author: Jean-Pierre PETIT

Publication date: February 10, 2001

You do not have access to this resource.
Click here to request your free trial access!

Already subscribed? Log in!


Overview

Français

Read this article from a comprehensive knowledge base, updated and supplemented with articles reviewed by scientific committees.

Read the article

AUTHOR

  • Jean-Pierre PETIT: Professor at École Centrale Paris

 INTRODUCTION

The evolution of electronics is leading to ever greater integration. Whereas in 1958 there was just one transistor per circuit, there are now at least half a million per integrated circuit silicon wafer (chip). While the technology used to make transistors for chips has evolved to reduce power consumption per transistor, the power dissipated per unit area of chip has increased. The very rapid increase in the number of transistors has not been offset by the reduction in thermal dissipation. In reality, the thermal problems encountered in equipment are not related to power but to temperature, which is a direct function of power density. In some computers, the power dissipated per unit area of chip is of the order of 500 kW/m 2 , i.e. quite comparable to the flux densities encountered at the nose of a space shuttle as it re-enters the atmosphere.

In the life of any piece of equipment, failures have two main causes:

  • those due to its design and/or component parts;

  • those due to the environment in which it is placed.

Climatic constraints result mainly from the effects of :

  • temperature ;

  • the action of humidity: it promotes corrosion, leads to changes in insulation resistance, and affects thermal exchanges in terms of thermal conductivity, which varies with water content;

  • at atmospheric pressure: involved in ventilation to evacuate dissipated power and in air renewal;

  • solar radiation, which can cause significant additional heating.

Other climatic conditions may also come into play, such as rain, wind, snow, freezing rain, dew, fog, etc., depending on the location and period of use.

All electronic components are temperature-sensitive: they perform poorly outside certain temperature limits, and can be destroyed if the temperature is well outside this operating range. The operating ranges are specified by the manufacturers and are commonly as follows:

  • industry: 0 to 70 ˚C ;

  • civil: - 20 to + 85 ˚C ;

  • military: -55 to 125 ˚C.

The maximum guaranteed operating temperature is always specified by the manufacturer. The influence of temperature can be seen in :

  • electrical performance: temperature can be a limiting value beyond which operation is no longer guaranteed, and parameter drifts can lead to a reduction in performance, which can be more...

You do not have access to this resource.

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource.
Click here to request your free trial access!

Already subscribed? Log in!


The Ultimate Scientific and Technical Reference

A Comprehensive Knowledge Base, with over 1,200 authors and 100 scientific advisors
+ More than 10,000 articles and 1,000 how-to sheets, over 800 new or updated articles every year
From design to prototyping, right through to industrialization, the reference for securing the development of your industrial projects

This article is included in

Electronics

This offer includes:

Knowledge Base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

Practical Path

Operational and didactic, to guarantee the acquisition of transversal skills

Doc & Quiz

Interactive articles with quizzes, for constructive reading

Subscribe now!

Ongoing reading
Heat dissipation in electronic systems