1. Board technologies
The most commonly used interconnection method for electronic components is the printed circuit board, on which components are assembled by soldering, gluing or direct transfer.
1.1 Multilayer printed circuit board
This is a composite material (woven glass fibers and resin) on which copper interconnection conductors are etched or printed. A higher density of interconnection per unit area has been achieved by the multi-layer technology commonly used today. This consists of a stack of sheets of organic resin-based composite material (dielectric) coated with copper (two-sided circuits), photo-etched and bonded together with a sheet of thermo-adhesive resin (prepreg) by means of temperature pressing (figure
Exclusive to subscribers. 97% yet to be discovered!
You do not have access to this resource.
Click here to request your free trial access!
Already subscribed? Log in!
The Ultimate Scientific and Technical Reference
This article is included in
Electronics
This offer includes:
Knowledge Base
Updated and enriched with articles validated by our scientific committees
Services
A set of exclusive tools to complement the resources
Practical Path
Operational and didactic, to guarantee the acquisition of transversal skills
Doc & Quiz
Interactive articles with quizzes, for constructive reading
Board technologies
References
Exclusive to subscribers. 97% yet to be discovered!
You do not have access to this resource.
Click here to request your free trial access!
Already subscribed? Log in!
The Ultimate Scientific and Technical Reference