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3. Temperature measurement under operating conditions
As presented in the previous section, methods for measuring the temperature of a chip, integrated into a power module, do not take into account the constraints linked to the conditions of use of a static converter (chopper, inverter or any other architecture). In fact, under these conditions, power components are subject to sudden, large-amplitude variations in the characteristic quantities generally measured to access thermosensitive electrical parameters. As a result, it is sometimes proposed to interrupt converter operation in order to recover the conditions required to use PETS. We can illustrate this approach on figure 19 with an example where an indirect measurement of component temperature is obtained...
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Temperature measurement under operating conditions
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Bibliography
Standards and norms
- Semiconductor devices – Discrete devices – Part 15 Isolated power semiconductor devices - IEC 60747-15 - 2010
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