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4. Conclusion
The need to measure the temperature of power components has led to the development of numerous solutions and methods, as discussed in this article. These approaches mainly rely on three distinct means, which will be discussed in the three paragraphs below that make up the conclusion. Indeed, while it is possible to deploy a combination of these approaches, the presentation made in the course of this article has demonstrated the differences in their respective technological maturity, as well as their qualification in terms of performance and robustness with regard to damage mechanisms.
4.1 Conventional PETS
The use of thermosensitive electrical characteristics of power components provides information on the temperature value of active parts. Without going back...
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- Semiconductor devices – Discrete devices – Part 15 Isolated power semiconductor devices - IEC 60747-15 - 2010
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