1. 2D power module

The packaging of the power module is the close environment of the semiconductor chips. It must meet certain conditions to ensure the correct operation of the chips:

• mechanical resistance: the packaging must protect the chip from moisture, dust and static electricity . It protects it mechanically by means of a cover, usually made of plastic;

• thermal management: the packaging must provide a path of low thermal resistance to evacuate as much as possible of the heat dissipated by the chip(s)...