6. Wiring wire

The power module's internal electrical connections, on semiconductor chips in particular, are generally made using Wire Bonding technology. These are wiring wires with a diameter of between 100 and 500 μm (figure 20 a) . They are generally made either of aluminum, combined, in proportions of a few ppm, with alloys that reduce the risk of aluminum corrosion (nickel) or increase its hardening (silicon or magnesium), or of gold. To avoid the formation...

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Bibliography

(1) - MASSON (A.), SABBAH (W.), RIVA (R.), BUTTAY (C.), AZZOPARDI (S.), MOREL (H.), PLANSON (D.), MEURET (R.) - Die attach using silver sintering. Practical implementation and analysis. - European Journal of Electrical Engineering, vol. 16, n° 13-14, p. 293-305, août 2013.
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