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5. Module life under thermal stress
5.1 Reliability and limitations in the field of power integration
In the broad context of system dependability, the Association française de normalisation (AFNOR) expresses reliability in the following terms: "Reliability is the characteristic of a device expressed by the probability that the device will perform a required function under conditions of use and for a specified period of time". Having become one of the key parameters in response to strong industrial demand, reliability is now associated with related notions such as availability, maintainability, product operating safety and security
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Module life under thermal stress
Conclusion and summary
Bibliography
Software tools
ANSYS http://www.ansys.com
ABAQUS http://www.simulia.com
MATLAB http://www.mathworks.com
Events
ESREF European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (international conference)
EPE Europeen conference on Power Electronics and Applications (international conference)
FIP http://www.mesago.de/en/PCIM/home.htm
ECPE European Center for...
Standards and norms
- Environmental condition and test procedures for airborne equipment, RTCA - DO 160 - 1997
- Ed. 1: Discrete Semiconductor devices – Part 15: Isolated power semiconductor devices - IEC 60747-15 -
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