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2. Integration technologies for power electronics
Power component assembly refers to the structure and technological processes used to interconnect one or more power chips in order to perform an electrical energy conversion function (chopper, inverter, etc.). Generally speaking, power integration is presented in three sub-assemblies:
level 1: active elements (semiconductors) ;
level 2: assembly ;
level 3: device protection.
Figure 3 shows the main parts of a power component:
the first level is made up of chips, generally silicon-based, which represent the active part...
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Conversion of electrical energy
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Integration technologies for power electronics
Application domains and constraints
Bibliography
Software tools
ANSYS http://www.ansys.com
ABAQUS http://www.simulia.com
MATLAB http://www.mathworks.com
Events
ESREF European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (international conference)
EPE Europeen conference on Power Electronics and Applications (international conference)
FIP http://www.mesago.de/en/PCIM/home.htm
ECPE European Center for...
Standards and norms
- Environmental condition and test procedures for airborne equipment, RTCA - DO 160 - 1997
- Ed. 1: Discrete Semiconductor devices – Part 15: Isolated power semiconductor devices - IEC 60747-15 -
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