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4. Manufacturing processes
The various ways of optimizing dielectric properties studied in the previous section are implemented by modifying the parameters of their manufacturing processes. Some processes are better suited to performance optimization than others, and a compromise has to be found between the possibilities and the complexity of the methods. Also, some applications present particular constraints in terms of process temperature or typical dielectric geometry sizes.
4.1 Requirements and possible processes for each industry
The use of dielectric materials embedded in printed circuit boards requires manufacturing temperatures below 250°C, which makes the use of ceramics quite restrictive. For these applications, it is often necessary to use polymer-matrix composites to integrate...
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Manufacturing processes
Performance comparison
Bibliography
Websites
Paumanok http://www.paumanokgroup.com
KEMET – Application notes for multilayer ceramic capacitors https://www.kemet.com/en/us.html _CerPerChar.pdf
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