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6. Conclusion
With ever-smaller devices and increasingly complex structures, the need to deposit conformal, thin layers of controlled thickness and composition has never been greater. The ALD technique, with its self-limiting and separated reactions, is able to meet these constraints. Because of these advantages, numerous ALD processes have been developed for a wide variety of materials, from metals to oxides, metal nitrides to complex ternary materials, enabling ALD to be used in a very diverse number of industrial applications. To meet this industrial need as effectively as possible, new reactor designs have emerged, such as the SALD
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Conclusion
Glossary
Bibliography
Websites
ALD Pulse
http://aldpulse.com/ (page consulted on June 2, 2016)
BALD Engineering
http://www.baldengineering.com/ (page consulted on June 2, 2016)
Virtual Project on the History of ALD...
Events
AVS-ALD conference, congress (conferences + trade show) held each year on a different continent.
Baltic-ALD conference, held every other year in a European city
Patents
Method for producing compound thin films, US. Patent 4 058 430 (1977).
Directory
Organizations – Federations – Associations (non-exhaustive list)
RafALD, French ALD Players' Network
HERALD, Hooking together European research in Atomic Layer Deposition
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