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5. ALD applications
The ALD deposition process, thanks to its ability to form dense, covering layers of material of controlled thickness, with precise control of stoichiometry, whatever the type of substrate (smooth, rough, nanostructured, complex geometry, 3D structures, polymer...) at relatively low temperatures (generally below 300°C), is used in a wide range of applications . Precise control of film thickness also makes it possible to develop new strategies for modifying the chemical or physical properties of nanometric materials, and to open up new synthesis routes for new nanostructures.
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ALD applications
Conclusion
Bibliography
Websites
ALD Pulse
http://aldpulse.com/ (page consulted on June 2, 2016)
BALD Engineering
http://www.baldengineering.com/ (page consulted on June 2, 2016)
Virtual Project on the History of ALD...
Events
AVS-ALD conference, congress (conferences + trade show) held each year on a different continent.
Baltic-ALD conference, held every other year in a European city
Patents
Method for producing compound thin films, US. Patent 4 058 430 (1977).
Directory
Organizations – Federations – Associations (non-exhaustive list)
RafALD, French ALD Players' Network
HERALD, Hooking together European research in Atomic Layer Deposition
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