2. Electrical characteristics of interconnections

2.1 Electronic component housings

Please refer to [E3400] and [E3405] in Techniques de l'Ingénieur for a description of electronic enclosure technologies, an example of which is shown in figure

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Electrical characteristics of interconnections

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page Positioning the problem

Signal integrity of electronic boards

Bibliography

(1) - NATIONAL SEMICONDUCTOR - Ttransmission lien rapide signer opération and applications guide - . Application note 905 (2000).
(2) - WALKER (C. S.) - Capacitance, Inductance and Crosstalk Analysis - . Artech House (1990).

Standards and norms

Products for printed circuit boards – Descriptive manufacturing data and transfer methodology – Part 2-2: Intermediate requirements for the implementation of printed boards – Description of manufacturing data - CEI 61182-2-2 - 2012
Printed boards and fitted printed boards – Design and use – Part 1-2: Generic requirements – Controlled impedance - CEI 61188-1-2 - 1998
Integrated circuits – Measurement of...

Regulations

EMC is subject to European legislation through the EMC directive, which is integrated with the CE marking directive that regulates the introduction of products onto the European market. A board designed to be integrated into a product and which is not itself a product placed on the European market is not subject to the CE marking obligation, and therefore not strictly to the requirements of the EMC directive. It must, however,...