Article | REF: E3955 V1

Cooling of electronics by liquid-vapour phase change

Authors: Jocelyn BONJOUR, Frédéric LEFEVRE, Valérie SARTRE, Bruno ALLARD

Publication date: June 10, 2023

You do not have access to this resource.
Click here to request your free trial access!

Already subscribed? Log in!


Français

1. Thermal issues in electronic systems

Components, whether active or passive, dissipate heat as they operate within electronic systems. Components associated with electronic functions supplying energy to external systems are in fact the most exposed to heat dissipation. Examples include power amplification within wireless radio functions (antenna power supply) or, more generally, power supply functions for systems or within systems (battery charger).

At low power levels [E 3 952] , or for noise reasons, a power supply can be based on a linear approach. In this case, heat dissipation is moderate, since...

You do not have access to this resource.

Exclusive to subscribers. 97% yet to be discovered!

You do not have access to this resource.
Click here to request your free trial access!

Already subscribed? Log in!


The Ultimate Scientific and Technical Reference

A Comprehensive Knowledge Base, with over 1,200 authors and 100 scientific advisors
+ More than 10,000 articles and 1,000 how-to sheets, over 800 new or updated articles every year
From design to prototyping, right through to industrialization, the reference for securing the development of your industrial projects

This article is included in

Electronics

This offer includes:

Knowledge Base

Updated and enriched with articles validated by our scientific committees

Services

A set of exclusive tools to complement the resources

Practical Path

Operational and didactic, to guarantee the acquisition of transversal skills

Doc & Quiz

Interactive articles with quizzes, for constructive reading

Subscribe now!

Ongoing reading
Thermal issues in electronic systems