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1. Component technology
1.1 Evolution towards nanometric scales
The evolution of component technologies is characterized by the introduction of a new technological "node" every two years, with device dimensions reduced by a factor of around 0.7, resulting in a doubling of integration density. In thirty years, device dimensions have been reduced by a factor of 100, and the number of logic gates per mm 2 has been multiplied by a factor of 10,000. The static memory point was implemented in a space of 0.1 mm 2 in 2011. After a significant reduction in the 1990s, the power supply to logic gates stabilized at around 1.0 V, while peak current per gate and intrinsic capacitance continued to fall (table
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Component technology
Standardized measurement methods
Bibliography
Software tools
INSA Toulouse, October 2011, IC-EMC (version for Windows XP, 7), 135 Av. de Rangueil, 31077 Toulouse, France, software available for free download at http://www.ic-emc.org
Sigrity, Campbell, California, USA, PowerSI software, version 10, 2010 (version for Windows XP), more information at
Websites
IEC (International Electrotechnical Commission) website : http://www.iec.ch
Here you'll find specifications for the various component modeling standards (draft IEC 62433), emission measurement methods (IEC 61967) and immunity (IEC 62132). See details in the "Norms and standards" section below.
ITRS (International...
Events
The international EMC Compo workshop takes place every two years. The workshop was held in November 2015 in Edinburgh. http://www.emccompo.org
Standards and norms
- Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1 GHz - IEC 61967 - 2002
- Integrated circuits – Measurement of electromagnetic immunity, 150 kHz to 1 GHz - IEC 62132 - 2006
- EMC IC modelling - IEC 62433 - 2010
- Integrated circuits – Measurement of impulse immunity - IEC 62215 - 2013
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