Français
3. Materials for microfluidics
In this section, we present the materials currently most widely used in the manufacture of microfluidic devices, namely polymer materials and glass. Their main advantages, characteristics and limitations will be described, and we will focus more specifically on processes for sealing microfluidic chips, and in particular a low-temperature glass sealing process.
3.1 Polymer materials
Polymeric materials used in the manufacture of microfluidic devices can be divided into four categories:
elastomers such as PDMS;
photosensitive resins such as SU-8 ;
Thermoplastics such as PMMA, COC, COP, PS, PEEK ;
paper.
...
The Ultimate Scientific and Technical Reference
This article is included in
Material processing - Assembly
This offer includes:
Knowledge Base
Updated and enriched with articles validated by our scientific committees
Services
A set of exclusive tools to complement the resources
Practical Path
Operational and didactic, to guarantee the acquisition of transversal skills
Doc & Quiz
Interactive articles with quizzes, for constructive reading
Materials for microfluidics
All-glass chips bonded at low temperatures: what applications?
Bibliography
Websites
Klearia http://www.klearia.com
Micralyne https://www.teledyne.com/en-us
Micronit http://www.micronit.com
Event
MicroTAS Congress
Directory
Industrial players: Klearia, Micronit, Micralyne, Micrux, Chip Shop, Dolomite
Research laboratories: LPN, LAAS, ESPCI, Institut Curie
Publications (magazines, books, etc.) : Lab on a Chip (see website)
Patents
Anodic bonding. US patent 3, 397.278 1968
Process for manufacturing a microfluidic chip. Associated chip and plate. Patent FR 1054183 CNRS May 28, 2010.
The Ultimate Scientific and Technical Reference
