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3. Materials for microfluidics
In this section, we present the materials currently most widely used in the manufacture of microfluidic devices, namely polymer materials and glass. Their main advantages, characteristics and limitations will be described, and we will focus more specifically on processes for sealing microfluidic chips, and in particular a low-temperature glass sealing process.
3.1 Polymer materials
Polymeric materials used in the manufacture of microfluidic devices can be divided into four categories:
elastomers such as PDMS;
photosensitive resins such as SU-8 ;
Thermoplastics such as PMMA, COC, COP, PS, PEEK ;
paper.
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Materials for microfluidics
All-glass chips bonded at low temperatures: what applications?
Bibliography
Websites
Klearia http://www.klearia.com
Micralyne https://www.teledyne.com/en-us
Micronit http://www.micronit.com
Event
MicroTAS Congress
Directory
Industrial players: Klearia, Micronit, Micralyne, Micrux, Chip Shop, Dolomite
Research laboratories: LPN, LAAS, ESPCI, Institut Curie
Publications (magazines, books, etc.) : Lab on a Chip (see website)
Patents
Anodic bonding. US patent 3, 397.278 1968
Process for manufacturing a microfluidic chip. Associated chip and plate. Patent FR 1054183 CNRS May 28, 2010.
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